Saturday, 19 September 2015

Teclast Air X98 3G - Perfect Cooling

 

In the following, we describe step by step how to make a heat-mod, with which you can reach better performance from your tablet and a better heat dissipation without so complicated changes on your mainboard.

This small Tip&Trick could seems simple... and at the end it's true... but you have to take care to some assembly details to apply it with just a small compromise.

The safety first of all, the right assembly and the result of tests will lead us along the way until the end.

What we need is... :
- a kapton tape
- a blister of Arctic silver paste
- a thermal pad (100x100x1mm for example)
- 3x 20x20x0.5mm copper pads


First of all, you have to open your Teclast tablet, about it there is some guide on youtube (we will not consider it in greater detail this procedure), then open the box that hidden Intel Processor - RAM - eMMC.

Now take your kapton tape and place it all around the Processor and RAM, as shown in the picture.



This step will protect all critical components from possible accidental squeezing of thermal paste, moreover this tape is resistant at high temperatures of Processor and RAM, so this particular procedure is particularly important for mainboard safety.

Then, you have to puts a dot of thermal paste on every RAM chips and on the processor and spread it (be careful) on the surfaces before fix the copper pads in place.


We cut two 20x20mm pads in dimensions of 20x13.5mm to fix the pads over the RAM chip, as shown in picture. This assures a great positioning and a better heat transfer. All pads are 0.5mm tall, such as the thermal pads of Teclast. This assure a better application of front metal cover plate.



Just some other dots of thermal paste on copper pads, then we can fix in place all pads with some other piece of tape. As shown in picture.



Now you have to close the front metal cover plate and cut the thermal pad as shown in picture. For positioning you can follow these pictures.



To optimize the pressure, you have to cut a minimal surface of thermal pad. Could be difficult, so to help you with this step, we have drawn this sheet with all measures. Follow the measures reported to reach a better result.


From our tests, we have found a problem with accelerometer and with the pressure on screen from behind, if we leave all thermal pad on metal plate.
So, to fix these problems we have made some calculation and we have found a simple solution, like this.


That's all. Now you can close the back side of case and get all benefit from this mod. The screen pressure is reduced from the fix on pad, but it's present in a small way, as shown in following pictures.



We place a tempered glass on screen, so it could be an air bubble between screen and glass due to pressure. Anyway, in front of screen it's invisible, only from the point of view of the picture it's possible to see something. So, we think it's a good compromise.


The temperature is after this mod of 41° C with a session of 15m of (only) CPU stress test and of 49° C with a session of 10m of gaming with Asphalt 8. A very good result, if we think that before, with CPU stress test we have reached 62° C of temperature!


It's pretty difficult after this trick to flash a BIOS via HW, because you have to remove all stuff before to proceed. So please, be careful at the next BIOS upgrade :D !


-----------------UPGRADE-----------------
Someone asked me to launch some benchmarks under Lollipop, to test Android after the modding. In the screenshots of benchmarks below you can see a performance boost with our improvement of heat transfer.

Antutu 5.x, it achieves an increase of more than 4000 points compared with previous result!


3DMark, a score of 583/625 at ES 3.1.



3DMark, a score of 806/855 at ES 3.0.



These are the results with Vellamo 3.2.





This is the result with GPUbench.



-----------------UPGRADE 2-----------------
We have obtained another optimization with which we solved the problem of pressure on screen seen before (excuse us for quality of pictures).

The solution is pretty simple. Open your tablet and peel off the brown aluminum film from metal cover.


Remove it completely and put it aside.


Cut a new 45x45mm thermal pad and a little piece from previous thermal pad (if you followed our guide previously...).


Place all stuff as shown below and close your tablet.


Now, you should reach 43° C as maximum temperature and about 41° C as an average.
2° C degree more than before, but without pressure on screen!

7 comments:

  1. Nice tutorial. We did the same thing. Also, that black heat pad is meant to keep heat from reaching the metal shell, so if we want to expell heat, its gotta go too.

    ReplyDelete
  2. Nice! thanks!
    did you had any issue to remove the screen? any tips how to do it best?
    also any tips where to find the copper?
    cheers

    ReplyDelete
  3. You really got to be careful about screen pressure, I also did some thermal mod on my Teclast X98 3G, but I applied a little too thick and too narrow thermal pad at first on the shielding! What happened was that after an extended gaming session the screen lost sensitivity and needed a reset (10 second screen off will do) or it even didn't registered in almost a quarter of the screen. I tried to fix it for 6-7 months, but finally yesterday when I received some nice 0.5mm thermal pads decided to remove the old pads, and voila problem fixed (and problem found)!

    ReplyDelete

  4. To know more about Thermal Pad click here Thermal Pad

    Also look our for our new website - http://www.aok-technologies.com/

    ReplyDelete